GAEA 750 Automatic Dispensing System
Dispensing system for electronic packaging in 3C and pan-semiconductor fields, mainly applied to:
1.Under-fill
2.Dam and Fill
3.Precision coating
4.Silver Paste, Hot Melt Adhesive
5.POP (Package on Package)
6.Solder Paste
And other fields Integrated with dispensing and automatic heating functions, it delivers high precision, superior quality and high reliability.
Modular design Maximum production flexibility Reduces manufacturing investment cost
Ultra-high-precision automatic laser height measurement system Intelligently accommodates various dispensing requirements for warped products Maintains consistent dispensing height
Track with automatic width adjustment Segmented track design/reduces board loading and unloading time (Optional)
5-megapixel resolution industrial camera wide range of precision dispensing requirements
GAEA 750 Automatic Dispensing System
Dispensing system for electronic packaging in 3C and Pan semiconductor fields mainly applied to:
1.Under-fill
2. Dam and Fill|
3. Precision Coating
4. Silver Paste, Hot Melt Adhesive
5. Package on Package
6. Solder Paste
Integrated with functions such as dispensing and automatic heating, it features high precision superior quality and high reliability
