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Electronics Manufacturing
APS 1100F Automatic Placement System
GAEA 700 Automatic Dispensing System
APS 900DB Automatic Bottom Placement System
Automatic Pressure Holding System
Automatic Flipping and Fixture Exchange System
Automatic Inkjet Coding System
Automatic Nozzle Cleaning, Inspection, Pick-and-Place & Storage System
Fully Automatic Universal Test Platform For 3C Industry
BMU Appearance Inspection Line
Automatic Assembly Line for Mouse Battery Packs
Automatic Assembly Line for Smartphone Battery Packs
Automatic Assembly Line for Wearable Battery Packs
Automatic Assembly Line for Notebook Battery Packs
Automatic FPC Production Line
MLB RF Automatic Test Line
Full Process Automatic MLB Assembly Line
SIP Fully-Automated Packaging Solution
Pan-Semiconductor
Advanced Packaging Solution
Lid Attach System-Heat Sink Mounting Machine
High-Thermal-Conductivity Medium Solution
Wafer Level Lid Attach Solution
System On Wafer
Process Auxiliary Equipment Solution
Lid Plasma Cleaning Machine
Tray to Boat Transfer Machine
2D Code Lasering & Transferring Machine
AI Server Solution
AI Server Modular Automation Line Solution
Optical Module
Lens / FA Optical Communication Module Dispensing System
GAEA 750 Automatic Dispensing System
MINI LED Die Bonder
New Energy
Solutions for EV
Automatic Assembly Line for New Energy Vehicle Motor-1
Automatic Assembly Line for New-Energy Vehicle Electronics Control Unit
Automatic Assembly Line for New Energy Vehicle Motor-2
Automatic Assembly Line for New Energy Vehicle Relay
Battery Water-Cooling Plate Production Line
Automated Prismatic Cell Production Line
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Investor Relations
Investor Services
Company Announcements
Periodic Announcements
Real-time Quotes
Contact Us
Company Profile
Company Profile
Company Milestones
Honors Certifications
Solutions
Electronics Manufacturing
APS 1100F Automatic Placement System
GAEA 700 Automatic Dispensing System
APS 900DB Automatic Bottom Placement System
Automatic Pressure Holding System
Automatic Flipping and Fixture Exchange System
Automatic Inkjet Coding System
Automatic Nozzle Cleaning, Inspection, Pick-and-Place & Storage System
Fully Automatic Universal Test Platform For 3C Industry
BMU Appearance Inspection Line
Automatic Assembly Line for Mouse Battery Packs
Automatic Assembly Line for Smartphone Battery Packs
Automatic Assembly Line for Wearable Battery Packs
Automatic Assembly Line for Notebook Battery Packs
Automatic FPC Production Line
MLB RF Automatic Test Line
Full Process Automatic MLB Assembly Line
SIP Fully-Automated Packaging Solution
Pan-Semiconductor
Advanced Packaging Solution
Lid Attach System-Heat Sink Mounting Machine
High-Thermal-Conductivity Medium Solution
Wafer Level Lid Attach Solution
System On Wafer
Process Auxiliary Equipment Solution
Lid Plasma Cleaning Machine
Tray to Boat Transfer Machine
2D Code Lasering & Transferring Machine
AI Server Solution
AI Server Modular Automation Line Solution
Optical Module
Lens / FA Optical Communication Module Dispensing System
GAEA 750 Automatic Dispensing System
MINI LED Die Bonder
New Energy
Solutions for EV
Automatic Assembly Line for New Energy Vehicle Motor-1
Automatic Assembly Line for New-Energy Vehicle Electronics Control Unit
Automatic Assembly Line for New Energy Vehicle Motor-2
Automatic Assembly Line for New Energy Vehicle Relay
Battery Water-Cooling Plate Production Line
Automated Prismatic Cell Production Line
News Center
Careers
Investor Relations
Investor Services
Company Announcements
Periodic Announcements
Real-time Quotes
Contact Us
Investor Services
Company Announcements
Periodic Announcements
Real-time Quotes
Investor Services
Company Announcements
Periodic Announcements
Real-time Quotes
2026年第三季度报告
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